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INTEGRATED CIRCUITS
PCK2002P 140 MHz PCI-X clock buffer
Product data File under Integrated Circuits ICL03 2001 May 09
Philips Semiconductors
Philips Semiconductors
Product data
140 MHz PCI-X clock buffer
PCK2002P
FEATURES
* General purpose and PCI-X 1:4 clock buffer * 8-pin TSSOP package * See PCK2001 for 48-pin 1:18 buffer part * See PCK2001M for 28-pin 1:10 buffer part * See PCK2001R for 16-pin 1:6 buffer part * Operating frequency: 0 - 140 MHz * Part-to-part skew < 500 ps * Low output skew: <200 ps * 3.3 V operation * ESD classification testing is done to JEDEC Standard JESD22.
Protection exceeds 2000 V to HBM per method A114.
PIN CONFIGURATION
PCK2002P
BUF_IN OE BUF_OUT0 VSS 1 2 3 4 8 7 6 5 BUF_OUT3 BUF_OUT2 VDD BUF_OUT1
TOP VIEW
SA00552
PIN DESCRIPTION
PIN NUMBER 1 I/O TYPE Input Output Input Input Input SYMBOL BUF_IN BUF_OUT (0-3) VDD OE VSS FUNCTION Buffered clock input Buffered clock outputs 3.3 V supply Output Enable Ground
DESCRIPTION
The PCK2002PL is a 1-4 fanout buffer used as a high-performance, low skew, general purpose and PCI-X clock buffer. It distributes one input clock (BUF_IN) signal to four output clocks (BUF_OUTn).
3, 5, 7, 8 6 2 4
QUICK REFERENCE DATA
SYMBOL tPLH tPHL tr tf ICC PARAMETER Propagation delay BUF_IN to BUF_OUTn Rise time Fall time Total supply current CONDITIONS VCC = 3.3 V, CL = 25 pF VCC = 3.3 V, CL = 25 pF, 0.2VDD to 0.6VDD VCC = 3.3 V, CL = 25 pF, 0.6VDD to 0.2VDD VCC = 3.6 V TYPICAL 2.9 2.8 800 600 50 UNIT ns ps ps A
ORDERING INFORMATION
PACKAGES 8-Pin Plastic TSSOP 8-Pin Plastic SO TEMPERATURE RANGE -40 to +85 C -40 to +85 C ORDER CODE PCK2002PDP PCK2002PD DRAWING NUMBER SOT505-1 SOT96-1
2001 May 09
2
853-2254 26252
Philips Semiconductors
Product data
140 MHz PCI-X clock buffer
PCK2002P
FUNCTION TABLE
OE L H H BUF_IN X L H BUF_OUTn L L H
ABSOLUTE MAXIMUM RATINGS1, 2
In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to VSS (VSS = 0 V). LIMITS SYMBOL VDD IIK VI IOK VO IO Tstg Ptot PARAMETER DC 3.3 V supply voltage DC input diode current DC input voltage DC output diode current DC output voltage DC output source or sink current Storage temperature range Power dissipation per package plastic medium-shrink SO (SSOP) For temperature range: 0 to +70 C above +55 C derate linearly with 11.3 mW/K VI < 0 Note 2 VO > VDD or VO < 0 Note 2 VO 0 to VDD CONDITION MIN -0.5 -- -0.5 -- -0.5 -- -65 -- MAX +4.3 -50 VDD + 0.5 50 VDD + 0.5 50 +150 850 UNIT V mA V mA V mA C mW
NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
SYMBOL VDD CL VI VO Tamb PARAMETER DC 3.3V supply voltage Capacitive load DC input voltage range DC output voltage range Operating ambient temperature range in free air CONDITIONS LIMITS MIN 3.0 20 0 0 -40 MAX 3.6 30 VDD VDD +85 UNIT V pF V V C
2001 May 09
3
Philips Semiconductors
Product data
140 MHz PCI-X clock buffer
PCK2002P
DC CHARACTERISTICS
LIMITS SYMBOL PARAMETER VDD VIH VIL VOH HIGH level input voltage LOW level input voltage (V) -- -- IOH = -1 mA IOH = -24 mA IOH = -12 mA IOL= 1 mA IOL= 24 mA IOL= 12 mA VOUT = 1 V VOUT = 1.65 V VOUT = 2.0 V VOUT = 1.65 V VI = VDD or GND VI = VDD or GND TEST CONDITIONS OTHER -- -- -- -- -- -- -- -- -- -- -- -- -- IO = 0 Tamb = -40 to +85 C MIN 2.0 VSS - 0.3 VDD - 0.2 2.0 2.4 -- -- -- -50 -- 60 -- -- -- MAX VDD + 0.3 0.8 -- -- -- 0.2 0.8 0.55 -- -150 -- 150 5 100 V V V V V V V V mA mA mA mA A A UNIT
3.0 to 3.6 3.0 to 3.6 3.0 to 3.6
Output HIGH voltage
3.0 3.0 3.0 to 3.6
VOL
Output LOW voltage
3.0 3.0 3.0
IO OH
Output HIGH current
3.3 3.0
IO OL II ICC
Output LOW current Input leakage current Quiescent supply current
3.3 3.6 3.6
2001 May 09
4
Philips Semiconductors
Product data
140 MHz PCI-X clock buffer
PCK2002P
AC CHARACTERISTICS
SYMBOL TH TL TH TL TR TF TPLH TPHL TSKW TDDSKW PARAMETER CLK HIGH time CLK LOW time CLK HIGH time CLK LOW time Output rise slew rate Output fall slew rate Buffer LH propagation delay Buffer HL propagation delay Bus CLK skew Device to device skew TEST CONDITIONS NOTES 66 MHz 140 MHz 2 3 2 3 4 4 5 5 1 1 MIN 6.0 6.0 2.9 3.0 1.4 1.5 1.8 1.8 -- -- LIMITS Tamb = -40 to +85 C TYP6 -- -- -- -- 1.7 2.2 2.9 2.8 -- -- MAX -- -- -- -- 4.0 4.0 3.4 3.4 200 500 ns ns ns ns V/ns V/ns ns ns ps ps UNIT
NOTES: 1. CLK skew is only valid for equal loading of all outputs. 2. TH is measured at 0.5 VDD as shown in Figure 2. 3. TL is measured at 0.35 VDD as shown in Figure 2. 4. TR and TF are measured as a transition through the threshold region 0.2 VDD to 0.6 VDD and 0.6 VDD to 0.2 VDD. 5. Input edge rate for these tests must be faster than 1 V/ns. 6. All typical values are at VCC = 3.3 V and Tamb = 25 C.
AC WAVEFORMS
VM = 50% VDD CL = 25 pF VOL and VOH are the typical output voltage drop that occur with the output load.
VDD BUF_IN INPUT VM VM
TEST CIRCUIT
VDD VDD
VI PULSE GENERATOR D.U.T. RT 0.6 VDD
VO
140
tPLH 0.6 VDD VM BUF_OUT 0.2 VDD TR
tPHL
CL
140
VM 0.2 VDD
SW00813
TF
Figure 3. Load circuitry for switching times
SW00811
Figure 1. Load circuitry for switching times.
tp th 0.5 VDD 0.4 VDD 0.35 VDD tl
SW00812
Figure 2. Buffer Output clock
2001 May 09
5
Philips Semiconductors
Product data
140 MHz PCI-X clock buffer
PCK2002P
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
2001 May 09
6
Philips Semiconductors
Product data
140 MHz PCI-X clock buffer
PCK2002P
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
2001 May 09
7
Philips Semiconductors
Product data
140 MHz PCI-X clock buffer
PCK2002P
Data sheet status
Data sheet status [1] Objective data Preliminary data Product status [2] Development Qualification Definitions This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Product data
Production
[1] Please consult the most recently issued datasheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support -- These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088-3409 Telephone 800-234-7381 (c) Copyright Philips Electronics North America Corporation 2001 All rights reserved. Printed in U.S.A. Date of release: 05-01 Document order number: 9397 750 08348
Philips Semiconductors
2001 May 09 8

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